Interface structure and surface morphology of (Co, Fe, Ni)/Cu/Si(100) thin films

We have examined bilayer Co/Cu, Fe/Cu, and Ni/Cu films deposited by molecular-beam epitaxy on hydrogen-terminated @100# silicon substrates. The magnetic metal/copper interface was examined by atomic resolution transmission electron microscopy and compared with the surface morphology as depicted by atomic force microscopy. The general orientation relationships across the magnetic metal/copper interfaces were found to be: @001#Co, Nii@001#Cu; ~010!Co, Nii~010!Cu and @001#Fei@001#Cu; ~110!Fei~200!Cu. The latter system is equivalent to the @11̄ 1#Fei@011#Cu and ~110!Fei~100!Cu Pitsch relationship, as has been reported earlier. Furthermore, there was a general correlation between interfacial and surface roughness, indicating that the initial interface character is propagated throughout the film during growth. © 1996 American Institute of Physics. @S0021-8979~96!03021-6#